Effect of as-pinted bondline thickness on assembling high power laser diodes by sintering of nanosilver paste

In this paper, we were trying to optimize bondline thickness of sintered nanosilver on assembling high power laser diode modules (40 W). The shear strength and void ratio of the sintered joints were reported in this work. Cavity surface contamination was discussed in cases of different as-printed bondline thickness. The electro-optical properties of the sinter-packed laser diode module by sintering of nanosilver paste were also characterized. We recommended that screen-printed bondline thickness of 20 microns was appropriate to bond 40 W 808 nm laser diodes and void ratio is less than 1%. The slope efficiency of the sinter-packed laser diode is 1.24 W/A, and the maximum efficiency at operating current can reach 58%.