Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions

The results indicate that the laser modules attached by nanosilver paste have a longer-term lifetime than those with indium and AuSn solders in continuous pulse conditions. Transient thermal behavior and coupled thermo-mechanical behavior in continuous pulse conditions are simulated by finite element method (FEM). A semi-empirical model based on Arrhenius relationship is established to provide relative reliability assessments for laser modules by combining with the simulating results.